Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11064613 | Electronics encapsulation through hotmelt lamination | Weifeng Liu, William L. Uy | 2021-07-13 |
| 10999926 | Stress relief encapsulation for flexible hybrid electronics | Weifeng Liu, William L. Uy | 2021-05-04 |
| 10896877 | System in package with double side mounted board | Cheng Yang, Bo Li, Venkat Iyer | 2021-01-19 |