Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11191165 | Method for manufacturing a circuit having a lamination layer using laser direct structuring process | Seung-hyuk Choi, Hyun Jun Hong, Tae Wook Kim, Young Sang Kim, Sung Jun Kim | 2021-11-30 |