Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11191165 | Method for manufacturing a circuit having a lamination layer using laser direct structuring process | Seung-hyuk Choi, Hyun Jun Hong, Tae Wook Kim, Cheong Ho Ryu, Sung Jun Kim | 2021-11-30 |
| 11021396 | Modified nonvolatile cold asphalt binder and recycled asphalt mixture using thereof | Young Ik Kim, Jeong-Ho Park | 2021-06-01 |
| 10881750 | Sentinel lymph node marker capable of multi-mode imaging | Seok Ki Kim, Se Hun Kang, Seo Il Kim, Nam Suk Baek, Jin Hee Noh | 2021-01-05 |