Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10982348 | Plating apparatus | Masashi Shimoyama | 2021-04-20 |
| 10968530 | Electroplating device | Tsutomu Nakada, Masashi Shimoyama | 2021-04-06 |
| 10934630 | Method for determining location of power feeding point in electroplating apparatus and electroplating apparatus for plating rectangular substrate | Mizuki Nagai, Naoto Takahashi | 2021-03-02 |