Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201126 | Method of producing a substrate and system for producing a substrate | Hitoshi Hoshino | 2021-12-14 |
| 11133219 | Method of processing a wafer | Hitoshi Hoshino, Dietmar Mayer | 2021-09-28 |
| 11011406 | Method of processing a substrate | Kensuke Nagaoka | 2021-05-18 |
| 10991612 | Method of processing wafer having protrusions on the back side | — | 2021-04-27 |
| 10991623 | Wafer processing method | Masatoshi WAKAHARA, Meiya Piao, Kentaro Odanaka, Wakana Onoe, Heidi Lan | 2021-04-27 |