HL

Heidi Lan

DI Disco: 3 patents #25 of 149Top 20%
Overall (2021): #81,559 of 548,734Top 15%
3
Patents 2021

Issued Patents 2021

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11024542 Manufacturing method of device chip 2021-06-01
10991622 Wafer processing method Meiyu Piao, Kentaro Odanaka, Masatoshi WAKAHARA, Wakana Onoe 2021-04-27
10991623 Wafer processing method Masatoshi WAKAHARA, Karl Heinz Priewasser, Meiya Piao, Kentaro Odanaka, Wakana Onoe 2021-04-27