Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189766 | Light emitting diode packages | Arthur Fong-Yuen Pun, Kyle Damborsky, Jae Hyung Park | 2021-11-30 |
| 11145689 | Indicia for light emitting diode chips | Nikolas Hall, Derek Miller, Anoop Mathew, Luis Breva, Jesse Colin Reiherzer +1 more | 2021-10-12 |
| 11107857 | Light emitting diodes, components and related methods | Jasper Cabalu, Kyle Damborsky | 2021-08-31 |
| 11101411 | Solid-state light emitting devices including light emitting diodes in package structures | Peter Scott Andrews, Jesse Colin Reiherzer, Arthur Fong-Yuen Pun | 2021-08-24 |
| 11101248 | Light emitting diodes, components and related methods | Jasper Cabalu, Kyle Damborsky | 2021-08-24 |
| D926714 | Light emitting diode package | Robert Wilcox | 2021-08-03 |
| 11083059 | Lumiphoric arrangements for light emitting diode packages | Aaron Francis, Kyle Damborsky, Robert Wilcox, Jasper Cabalu | 2021-08-03 |
| 11024613 | Lumiphoric material region arrangements for light emitting diode packages | David Suich, Arthur Fong-Yuen Pun | 2021-06-01 |
| 10991861 | Low optical loss flip chip solid state lighting device | Michael John Bergmann, Matthew Donofrio, Peter Scott Andrews, Troy Gould, Jack Vu | 2021-04-27 |
| 10957736 | Light emitting diode (LED) components and methods | Aaron Francis, Jasper Cabalu | 2021-03-23 |
| 10950769 | Light emitting diode (LED) components including multiple LED dies that are attached to lead frames | Michael John Bergmann, Arthur Fong-Yuen Pun, Jesse Colin Reiherzer | 2021-03-16 |