Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11172576 | Method for producing a printed circuit board structure | Johannes Stahr | 2021-11-09 |
| 11058004 | Metallic layer as carrier for component embedded in cavity of component carrier | Christian Galler, Gerhard Stubenberger | 2021-07-06 |