Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11172576 | Method for producing a printed circuit board structure | Mike Morianz | 2021-11-09 |
| 11049778 | Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity | Gerald Weidinger, Gerhard Schmid, Andreas Zluc | 2021-06-29 |