Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171249 | Wafer-level methods for manufacturing uniform layers of material on optoelectronic modules | Sonja Gantner-Hanselmann, Özkan Ahishali | 2021-11-09 |
| 11114593 | Optoelectronic modules and optoelectronic molding tools and processes for manufacturing the same | Sonja Gantner, Oezkan Ahishali | 2021-09-07 |
| 11013123 | Molded circuit substrates | Bojan Tesanovic, Nicola Spring, Simon Gubser, Mario Cesana | 2021-05-18 |