Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114573 | Optoelectronic module assembly and manufacturing method | Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirniö, Hartmut Rudmann | 2021-09-07 |
| 11013123 | Molded circuit substrates | Bojan Tesanovic, Simon Gubser, Robert Lenart, Mario Cesana | 2021-05-18 |