Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11101237 | Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer | Chi-Yu Wang | 2021-08-24 | $2,094,000 |
| 11037898 | Semiconductor device package and method for manufacturing the same | Chi-Yu Wang | 2021-06-15 | $2,096,000 |