Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101237 | Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer | Chi-Yu Wang | 2021-08-24 |
| 11037898 | Semiconductor device package and method for manufacturing the same | Chi-Yu Wang | 2021-06-15 |