Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11175715 | Method of supplying electric power to a computer system | — | 2021-11-16 | |
| 11101237 | Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer | Ming Hsien Chu | 2021-08-24 | $2,094,000 |
| 11037898 | Semiconductor device package and method for manufacturing the same | Ming Hsien Chu | 2021-06-15 | $2,096,000 |