Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11175715 | Method of supplying electric power to a computer system | — | 2021-11-16 |
| 11101237 | Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer | Ming Hsien Chu | 2021-08-24 |
| 11037898 | Semiconductor device package and method for manufacturing the same | Ming Hsien Chu | 2021-06-15 |