Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133245 | Semiconductor package structure and method for manufacturing the same | Hui-Ying Hsieh, Kuo-Hua Chen, Cheng-Yuan Chen | 2021-09-28 |
| 11127707 | Semiconductor package structure and method for manufacturing the same | Hui-Ying Hsieh, Hui Hua LEE, Cheng-Yuan Chen | 2021-09-21 |
| 11037868 | Semiconductor device package and method of manufacturing the same | Hui Hua LEE, Hui-Ying Hsieh, Cheng-Hung Ko | 2021-06-15 |