Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133245 | Semiconductor package structure and method for manufacturing the same | Chi-Tsung Chiu, Hui-Ying Hsieh, Kuo-Hua Chen | 2021-09-28 |
| 11127707 | Semiconductor package structure and method for manufacturing the same | Chi-Tsung Chiu, Hui-Ying Hsieh, Hui Hua LEE | 2021-09-21 |