Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10843284 | Method for void reduction in solder joints | — | 2020-11-24 |
| 10638637 | Component cooling device | Dietmar Kieslinger, Emanuel WEBER | 2020-04-28 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10843284 | Method for void reduction in solder joints | — | 2020-11-24 |
| 10638637 | Component cooling device | Dietmar Kieslinger, Emanuel WEBER | 2020-04-28 |