Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665563 | Semiconductor chip packaging structure without soldering wire, and packaging method thereof | Hsiang-Yi Cheng | 2020-05-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665563 | Semiconductor chip packaging structure without soldering wire, and packaging method thereof | Hsiang-Yi Cheng | 2020-05-26 |