Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840085 | Method for improving bonding of dangling bonds of silicon atoms | Xilong Wang, Wen Chao Zou | 2020-11-17 |
| 10756061 | Multi-layer chip and fabrication method thereof | Jing Cao | 2020-08-25 |