Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867797 | Methods and apparatuses related to shaping wafers fabricated by ion implantation | Alexander V. Suvorov, Robert Tyler Leonard | 2020-12-15 |
| 10868169 | Monolithically integrated vertical power transistor and bypass diode | Vipindas Pala, Lin Cheng, Anant Agarwal, John Williams Palmour | 2020-12-15 |
| 10861931 | Power semiconductor devices having gate trenches and buried edge terminations and related methods | Daniel Jenner Lichtenwalner, Brett Hull | 2020-12-08 |
| 10847647 | Power semiconductor devices having top-side metallization structures that include buried grain stop layers | Shadi Sabri, Daniel Jenner Lichtenwalner, Scott Allen, Brett Hull | 2020-11-24 |
| 10615274 | Vertical semiconductor device with improved ruggedness | Daniel Jenner Lichtenwalner | 2020-04-07 |
| 10600903 | Semiconductor device including a power transistor device and bypass diode | Vipindas Pala, Lin Cheng | 2020-03-24 |