Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847647 | Power semiconductor devices having top-side metallization structures that include buried grain stop layers | Shadi Sabri, Daniel Jenner Lichtenwalner, Edward Robert Van Brunt, Brett Hull | 2020-11-24 |
| 10707858 | Power module with improved reliability | Mrinal K. Das, Adam Barkley, Brian Fetzer, Jonathan D. Young, Van Mieczkowski | 2020-07-07 |