Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818616 | Semiconductor package structure and method for forming the same | Chun-Hung Chen, Chu-Fu Lin | 2020-10-27 |
| 10790248 | Three-dimensional integrated circuit and method of manufacturing the same | Chun-Hung Chen | 2020-09-29 |