Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629511 | Heat dissipation substrate, manufacturing method thereof and chip package structure | Chien-Chen Lin | 2020-04-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629511 | Heat dissipation substrate, manufacturing method thereof and chip package structure | Chien-Chen Lin | 2020-04-21 |