Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10615100 | Electronics assemblies and cooling structures having metalized exterior surface | — | 2020-04-07 |
| 10566265 | Electronic assemblies having a cooling chip layer with impingement channels and through substrate vias | Ercan Mehmet Dede | 2020-02-18 |