Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790209 | Wiring circuit substrate, semiconductor device, method of producing the wiring circuit substrate, and method of producing the semiconductor device | — | 2020-09-29 |
| 10679865 | Method of dicing wiring substrate, and packaging substrate | Yuki Nitta | 2020-06-09 |