Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10755973 | Metal wiring layer forming method, metal wiring layer forming apparatus and recording medium | Keiichi Fujita, Kazutoshi Iwai | 2020-08-25 |
| 10731256 | Plating apparatus, plating method, and recording medium | Kazutoshi Iwai, Yuichiro Inatomi, Takashi Tanaka | 2020-08-04 |