Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10660217 | Methods of fast fabrication of single and multilayer circuit with highly conductive interconnections without drilling | Jun Yang, Tengyuan Zhang | 2020-05-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10660217 | Methods of fast fabrication of single and multilayer circuit with highly conductive interconnections without drilling | Jun Yang, Tengyuan Zhang | 2020-05-19 |