Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861777 | Wire bond clamp design and lead frame capable of engaging with same | Hung-Yu Chou, Fu-Kang Lee | 2020-12-08 |
| 10811343 | Method of making a wire support leadframe for a semiconductor device | Chih-Chien Ho, Steven Su | 2020-10-20 |
| 10573581 | Leadframe | Chih-Chien Ho, Chung-Hao Lin | 2020-02-25 |
| 10529654 | Wire support for a leadframe | Chih-Chien Ho, Steven Su | 2020-01-07 |