Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770377 | Leadframe die pad with partially-etched groove between through-hole slots | Rolando Mendoza Chan, Kent Lacson Capan | 2020-09-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770377 | Leadframe die pad with partially-etched groove between through-hole slots | Rolando Mendoza Chan, Kent Lacson Capan | 2020-09-08 |