Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629562 | Integrated circuit packaging | Honglin Guo, Byron Lovell Williams, Jeffrey Alan West, Anderson Li, Arvin Nono Verdeflor | 2020-04-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629562 | Integrated circuit packaging | Honglin Guo, Byron Lovell Williams, Jeffrey Alan West, Anderson Li, Arvin Nono Verdeflor | 2020-04-21 |