Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867979 | Circuit mounting structure and lead frame for system in package (SIP) devices | Masood Murtuza | 2020-12-15 |
| 10714430 | EMI shield for molded packages | Masood Murtuza, Peter Robert Linder | 2020-07-14 |