Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10580723 | Flat no-lead packages with electroplated edges | Reynaldo Corpuz Javier, Alok Kumar Lohia | 2020-03-03 |
| 10541194 | Semiconductor package with interconnected leads | Jeffrey Gail Holloway | 2020-01-21 |