Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863640 | Packaging structure and packaging method | — | 2020-12-08 |
| 10822467 | Dynamic networks for recycling thermoset polymers | Vahab Solouki Bonab, Ammar Patel, Dian Yuan, Vahid Karimkhani, Ica Manas-Zloczower | 2020-11-03 |