Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748989 | Insulating layer structure for semiconductor product, and preparation method of insulating layer structure | Wenlin Gao, Xiang Li | 2020-08-18 |
| 10687251 | Service flow with robust header compression (ROHC) in a WiMAX wireless network | Wenhui Yuan, Randy Kuang | 2020-06-16 |