Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10699954 | Through-substrate vias formed by bottom-up electroplating | Alexandros P. Papavasiliou, Adam Young, Jeff DeNatale | 2020-06-30 |
| 10613319 | Compact, high-performance MEMS-based optical shutter | Alex Papavasiliou, Philip A. Stupar, Jeffrey F. DeNatale, Maximillian A. Perez | 2020-04-07 |