Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10836919 | Solvent-free resin composition and uses of the same | Chin-Hsien Hung | 2020-11-17 |
| 10793716 | Resin composition and uses of the same | Meng-Huei Chen | 2020-10-06 |
| 10774216 | Resin composition and uses of the same | Meng-Huei Chen | 2020-09-15 |
| 10689512 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same | Meng-Huei Chen | 2020-06-23 |
| 10662352 | Adhesive composition and uses of the same | Chin-Hsien Hung | 2020-05-26 |
| 10575401 | Dielectric composite and uses thereof | Chin-Hsien Hung, Wei Yang, Chang Liu | 2020-02-25 |
| 10568211 | Resin composition and uses of the same | Meng-Huei Chen | 2020-02-18 |