Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10563006 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same | Guan-Syun Tseng, Ju-Ming Huang, Tsung-Hsien Lin, Chih-Wei Liao | 2020-02-18 |