Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867109 | Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects | Hsien Yu Tseng, Chun-Wei Chang, Szu-Lin Liu, Amit Kundu | 2020-12-15 |
| 10576499 | Ultrasonic phased array probe using PCB as matching layer | Ronald Joseph Keller, JR. | 2020-03-03 |