Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763168 | Semiconductor structure with doped via plug and method for forming the same | Tung-Po Hsieh, Su-Hao Liu, Jing-Huei Huang, Jie Huang, Lun-Kuang Tan +3 more | 2020-09-01 |