Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840201 | Methods and apparatus for transmission lines in packages | Hsiao-Tsung Yen, Min-Chie Jeng, Yu-Ling Lin | 2020-11-17 |
| 10714441 | Filter and capacitor using redistribution layer and micro bump layer | Hsiao-Tsung Yen, Jhe-Ching Lu, Yu-Ling Lin, Min-Chie Jeng | 2020-07-14 |
| 10665380 | Compact vertical inductors extending in vertical planes | Hsiao-Tsung Yen, Huan-Neng Chen, Yu-Ling Lin, Mei-Show Chen, Ho-Hsiang Chen +1 more | 2020-05-26 |
| 10665539 | Semiconductor device with patterned ground shielding | Hsiao-Tsung Yen, Cheng-Wei Luo, Kung-Hao Liang | 2020-05-26 |
| 10629756 | Semiconductor structure | Hsiao-Tsung Yen, Yu-Ling Lin, Ho-Hsiang Chen, Chewn-Pu Jou, Min-Chie Jeng | 2020-04-21 |