Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10693004 | Via structure with low resistivity and method for forming the same | Kuo-Chiang Tsai, Fu-Hsiang Su, Ke-Jing Yu, Jyh-Huei Chen | 2020-06-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10693004 | Via structure with low resistivity and method for forming the same | Kuo-Chiang Tsai, Fu-Hsiang Su, Ke-Jing Yu, Jyh-Huei Chen | 2020-06-23 |