Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10680076 | Trench power semiconductor and method of making the same | Chun-Ying Yeh, Yuan-Ming Lee | 2020-06-09 |
| 10629452 | Manufacturing method of a chip package structure | Chih-Cheng Hsieh | 2020-04-21 |
| 10559674 | Manufacturing method of a trench power semiconductor device | Chun-Ying Yeh, Chun-Wei Ni, Yuan-Ming Lee | 2020-02-11 |
| 10529847 | Trench power semiconductor component and method of manufacturing the same | — | 2020-01-07 |