Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10601147 | Method of bonding core wire and bonding object, ultrasonic bonding device, and junction between core wire and bonding object | Masamichi Yamagiwa, Takuya Suzuki, Daichi MIURA | 2020-03-24 |