Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872845 | Process for manufacturing a flip chip semiconductor package and a corresponding flip chip package | Mauro MAZZOLA, Matteo DE SANTA | 2020-12-22 |
| 10741415 | Thermosonically bonded connection for flip chip packages | Mauro MAZZOLA, Matteo DE SANTA | 2020-08-11 |