Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10841710 | Package structure of micro-electro-mechanical-system microphone package and method for packaging the same | Chien-Hsing Lee, Cheng-Wei Tsai | 2020-11-17 |
| 10798493 | Micro-electro-mechanical systems (MEMS) device and method for fabricating the MEMS | Chien-Hsing Lee, Cheng-Wei Tsai | 2020-10-06 |
| 10728674 | Microphone package | Li-Chi Tsao, Chien-Hsing Lee, Jhyy-Cheng Liou | 2020-07-28 |