Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10869362 | WLAN front-end | Chun-Wen Paul Huang, Lui Lam, Mark M. Doherty | 2020-12-15 |
| 10790788 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Bharatjeet Singh Gill, Stephen Joseph Kovacic | 2020-09-29 |