Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629543 | Package substrates having an electromagnetic bandgap structure and semiconductor packages employing the package substrates | Hye Won Kim, Won Duck JUNG | 2020-04-21 |
| 10615129 | Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure | Won Duck JUNG, Sang Joon LIM | 2020-04-07 |