Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10593641 | Package method and package structure of fan-out chip | Chengchung Lin | 2020-03-17 |
| 10553458 | Chip packaging method | Chengchung Lin | 2020-02-04 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10593641 | Package method and package structure of fan-out chip | Chengchung Lin | 2020-03-17 |
| 10553458 | Chip packaging method | Chengchung Lin | 2020-02-04 |