Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10613145 | Configuration and testing method and system for FPGA chip using bumping process | Bin Luo, Hua Wang, Xuefei Tang, Jianbo Ling, Jianming Ye | 2020-04-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10613145 | Configuration and testing method and system for FPGA chip using bumping process | Bin Luo, Hua Wang, Xuefei Tang, Jianbo Ling, Jianming Ye | 2020-04-07 |