Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868017 | Memory structure and manufacturing method thereof | Shih-Ping Lee, Shyng-Yeuan Che, Hsiao-Pei Lin, Kuo-Fang Huang | 2020-12-15 |
| 10811367 | Fabrication method of semiconductor package | Hui-Chuan Lu, Chun-Hung Lu | 2020-10-20 |
| 10774427 | Fabrication method of substrate having electrical interconnection structures | Chun-Hung Lu | 2020-09-15 |