Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796970 | Method for fabricating electronic package | Chang-Lun Lu | 2020-10-06 |
| 10622323 | Fabrication method of semiconductor package with stacked semiconductor chips | — | 2020-04-14 |